PKG Application (THP-100 DX series) HDIApplicaiton (THP-100 Z series)
High Tg / Low CTE
Short thermal curing : 150℃ / 15~30 min
High reliability: -65℃ ↔150℃,1000 cycle ⇒ No Crack
high heat resistance : 288℃ / 10 sec/ 5cycle, No Crack
Reduced shrinkage after curing
Applicable CCLs with high aspect ratio
Applicable electroless plating processes
Shelf life : 180days (Storage condition : 10℃ below)