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Photoimageable Solder Resist for FPC

  • Features

    It is a high-sensitivity flexible photoimageable solder resist with flexibility.

  • How to use

    Standard conditions
    Printing: Screen printing
    Semi-drying: 80 ℃ 15 ~ 30min
    Exposure: 100 ~ 500mJ / cm2
    Development: 1wt % Na2CO3
    Post curing: 150 ℃ 60min

  • Series product list

    PSR-9000 FLX501

    It is a green flexible solder resist with excellent adhesiveness and flexibility.

    Technical data
    PSR-9000 FLX505EM

    It is a black flexible solder resist with excellent adhesiveness and flexibility.

    Technical data
    PSR-9000 FLX29EML

    It is a highly heat-resistant black flexible solder resist capable of UVDI exposure response.

    Technical data