Thermal Curable Permanent Hole-Plugging Material
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Features
It is characterized by low thermal expansion, high heat resistance, short-time curing, excellent wear resistance, etc. For package boards requiring a high reliability or boards requiring heat resistance, DM series multilayer board is suitable, while Z se
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How to use
Standard conditions
Printing: Only TH parts printed through a screen
Curing: 120 ~ 150 ℃ 30 ~ 60 min
Grinding: Protruded ink removed by buff grinding
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Series product list
THP-100 Z2KIt is a thermal Curable Permanent Hole-Plugging Material with an excellent stability allowing short-time curing.
Technical dataTHP-100 DX1It is a thermal Curable Permanent Hole-Plugging Material with low curing shrinkage and excellent reliability.
Technical data