PRODUCTS

Thermal Curable Permanent Hole-Plugging Material

  • Features

    It is characterized by low thermal expansion, high heat resistance, short-time curing, excellent wear resistance, etc. For package boards requiring a high reliability or boards requiring heat resistance, DM series multilayer board is suitable, while Z se

  • How to use

    Standard conditions
    Printing: Only TH parts printed through a screen
    Curing: 120 ~ 150 ℃ 30 ~ 60 min
    Grinding: Protruded ink removed by buff grinding

  • Series product list

    THP-100 Z2K
    THP-100 DX1