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Thermal Curable Permanent Hole-Plugging Material

  • Features

    It is characterized by low thermal expansion, high heat resistance, short-time curing, excellent wear resistance, etc. For package boards requiring a high reliability or boards requiring heat resistance, DM series multilayer board is suitable, while Z se

  • How to use

    Standard conditions
    Printing: Only TH parts printed through a screen
    Curing: 120 ~ 150 ℃ 30 ~ 60 min
    Grinding: Protruded ink removed by buff grinding

  • Series product list

    THP-100 Z2K

    It is a thermal Curable Permanent Hole-Plugging Material with an excellent stability allowing short-time curing.

    Technical data
    THP-100 DX1

    It is a thermal Curable Permanent Hole-Plugging Material with low curing shrinkage and excellent reliability.

    Technical data