Dry-Film solder resist
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Features
Dry-Film resist of photoimageable is eco-friendly and strong against contamination. It is a photoimageable fil allowing thin-film response, flatness, and fine patterns.
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How to use
Standard conditions
Lamination: Compressed by vacuum laminator
Exposure: 100 ~ 500mJ / cm2 →Exposure carrier film delaminated
Development: 1wt % Na2CO3
Post curing: 150 ℃
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Series product list
PSR-400 MB15CM20It is a black dry-film solder resist of photoimageable with excellent flatness and allowing the use for diversified boards.
Technical dataPSR-400 MB15CM02It is a blue dry-film solder resist of photoimageable with excellent flatness and allowing the use for diversified boards.
Technical data